High-Precision Eutectic Die Bonder
ET-506
Features
● Supports both face-up and flip-chip processes, and can simultaneously place three types of components, simplifying the packaging process and improving product yield.
● The holder is loaded and unloaded in a streamlined manner, effectively enhancing production efficiency.
● Material visual recognition and positioning, with position and angle compensation to ensure placement accuracy.
Specifications
| System Accuracy | |
| Placement Accuracy | ±10 μm |
| Angular Accuracy | ±1° |
| 速度 | |
| UPH | 480 pcs / H |
| Bondhead | |
| Quantity | 3 sets |
| Function | Pick, Place & Flip-Chip |
| Resolution | X/Y: ±0.5 μm | Z: ±1 μm| θ: 0.1° |
| Bond Force | 10-50 g |
| Material Handling Capability | |
| Package | TO 9, TO 38, TO 46, TO 56, Zener |
| Header Feeding | Tray or Mold bar (200 pcs/tray) |
| Wafer Feeding | 6″ Wafer × 3 |
| Chip Size | 0.20 × 0.20 mm – 4 × 4 mm |
| Dimensions & Weight | |
| Dimensions | 1790 × 1320 × 1820 mm |
| Net Weight | 1200 kg |
Cases
AOI
AOI has introduced several of our high-precision eutectic die bonding machines, which are applied in the critical chip packaging processes for its 800G / 1.6T high-speed optical modules.
Chengdu Sunstar
Chengdu Guangheng has introduced several of our die bonding machines, which are used in the high-reliability packaging and manufacturing of core chips in optical modules.
Accelink
Accelink has introduced several of ourdie bonding machines, which are applied in the precision eutectic packaging processes of core chips used in high-speed optical modules and optical interconnect products.
