REB SEMICONDUCTOR FOR A SMARTER FUTURE

Dedicated to R&D, manufacturing, and commercialization of advanced semiconductor packaging equipment

About

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REB SEMICONDUCTOR is a professinoal semiconductor packaging equipment solution provider in China, dedicated to R&D, manufacturing, and commercialization of advanced semiconductor packaging equipment.

Our solutions serve a wide range of applications, including optical communications, laser devices, power semiconductors, and automotive electronics - supporting the global advancement of digitalzation and intelligent manufacturing in semiconductor packaging.

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Established Time

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Technical Patents

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R&D Ratio

100 million+

Turnover in 2025

Solutions

Semiconductor

Semiconductor

Targeting high-end packaging and precision manufacturing scenarios, we provide stable, highly consistent automation solutions that address core process and critical equipment requirements.

Optical Communications

Optical Communications

Targeting the demands of high-speed data transmission and optical module manufacturing, we provide high-precision automated equipment and stable, reliable production solutions.

New Energy

New Energy

Targeting the new energy battery and related industrial chains, we provide automated production line equipment and intelligent manufacturing solutions to support efficient and stable production.

Products

High-Precision Eutectic Die Bonder RD-4000
The RD-4000 is specifically designed for COB, COC eutectic packaging, as well as small-volume adhesive bonding applications. It offers flexible adaptability to various chip sizes and complex packaging processes.
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High-Precision Eutectic Die Bonder ET-505
It enables eutectic bonding for both the heat sink and the chip on the same holder, simplifying the packaging process and improving product yield. The holder is loaded and unloaded in a streamlined manner, effectively enhancing production efficiency.
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Multifunctional Die Bonder DB-561P
Suitable for substrate-to-chip bonding in COB/COC processes, using either adhesive die bonding or heated eutectic bonding. Features a linear motor structure and a high-precision CCD recognition and positioning system to ensure placement accuracy.
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Pin Ultrasonic Welding Machine UT-600B
Full servo control with precise regulation of welding pressure and displacement; the welding process can be divided into multiple stages. Integrated automatic cleaning system with ion air purge in a sealed environment.
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High-Precision Eutectic Die Bonder
RD-4000
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High-Precision Eutectic Die Bonder
ET-505
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Multi-Functional Die Bonder
DB-561P
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Pin Ultrasonic Welding Machine UT-600B
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High-Precision Eutectic Die Bonder RD-4000
The RD-4000 is specifically designed for COB, COC eutectic packaging, as well as small-volume adhesive bonding applications. It offers flexible adaptability to various chip sizes and complex packaging processes.
View Details
High-Precision Eutectic Die Bonder ET-505
It enables eutectic bonding for both the heat sink and the chip on the same holder, simplifying the packaging process and improving product yield. The holder is loaded and unloaded in a streamlined manner, effectively enhancing production efficiency.
View Details
Multifunctional Die Bonder DB-561P
Suitable for substrate-to-chip bonding in COB/COC processes, using either adhesive die bonding or heated eutectic bonding. Features a linear motor structure and a high-precision CCD recognition and positioning system to ensure placement accuracy.
View Details
Pin Ultrasonic Welding Machine UT-600B
Full servo control with precise regulation of welding pressure and displacement; the welding process can be divided into multiple stages. Integrated automatic cleaning system with ion air purge in a sealed environment.
View Details

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