High-Precision Eutectic Die Bonder
ET-506
Equipment Features
● Supports both face-up and flip-chip processes, and can simultaneously place three types of components, simplifying the packaging process and improving product yield.
● The holder is loaded and unloaded in a streamlined manner, effectively enhancing production efficiency.
● Material visual recognition and positioning, with position and angle compensation to ensure placement accuracy.
Equipment Specifications
Customer Cases
US AOI
US AOI has introduced 10 units of our high-precision eutectic die bonders, applied in the critical chip packaging process for its 800G/1.6T high-speed optical modules.
Chengdu Guangheng Communication
Chengdu Guangheng has introduced 20 units of our high-precision eutectic die bonders, applied in the high-reliability packaging manufacturing of core optoelectronic chips for high-speed optical modules.
Wuhan Accelink Technologies
Wuhan Accelink has introduced 30 units of our high-precision eutectic die bonders, applied in the precision eutectic packaging process for core optoelectronic chips used in high-speed optical modules and advanced optical interconnect products.
