High-Precision Eutectic Die Bonder
RD-4000
Equipment Features
● Designed with a unique dual-bond-head and dual-eutectic-stage configuration, specifically engineered for COC eutectic packaging as well as small-volume adhesive bonding applications.
● Full closed-loop control of torque and position ensures micron-level placement accuracy and pressure stability.
● Automatic nozzle changing system flexibly adapts to various chip sizes and complex packaging processes.
Equipment Specifications
Customer Cases
US AOI
US AOI has introduced 10 units of our high-precision eutectic die bonders, applied in the critical chip packaging process for its 800G/1.6T high-speed optical modules.
Chengdu Guangheng Communication
Chengdu Guangheng has introduced 20 units of our high-precision eutectic die bonders, applied in the high-reliability packaging manufacturing of core optoelectronic chips for high-speed optical modules.
Wuhan Accelink Technologies
Wuhan Accelink has introduced 30 units of our high-precision eutectic die bonders, applied in the precision eutectic packaging process for core optoelectronic chips used in high-speed optical modules and advanced optical interconnect products.
