Multi-Functional Die Bonder
DB-561P
Features
● Suitable for substrate-to-chip bonding in COB/COC processes, using either adhesive die bonding or heated eutectic bonding.
● Linear motor structure and high-precision CCD recognition and positioning system to ensure placement accuracy.
● Equipped with three independent pick-and-place heads for multi-chip die bonding.
Specifications
| System Accuracy | |
| Placement Accuracy | ±5 μm |
| Angular Accuracy | ±0.3° |
| 速度 | |
| UPH | 500 pcs / H |
| Bondhead | |
| Quantity | 3 sets |
| Function | Dispense, Pick & Place |
| Resolution | X/Y: ±0.5 μm | Z: ±1 μm| θ: 0.01° |
| Bond Force | 10-50 g |
| Material Handling Capability | |
| Package | COB, COS, BOX |
| Wafer Feeding | 6″ Wafers × 3 |
| Tray Feeding | 2″ Trays × 6 (Waffle-pack, Gel-pack) |
| Chip Size | 0.20 × 0.20 mm – 4 × 4 mm |
| Dimensions & Weight | |
| Dimensions | 1470 × 1470 × 1880 mm |
| Net Weight | 1500 kg |
Cases
AOI
AOI has introduced several of our high-precision eutectic die bonding machines, which are applied in the critical chip packaging processes for its 800G / 1.6T high-speed optical modules.
Chengdu Sunstar
Chengdu Guangheng has introduced several of our die bonding machines, which are used in the high-reliability packaging and manufacturing of core chips in optical modules.
Accelink
Accelink has introduced several of ourdie bonding machines, which are applied in the precision eutectic packaging processes of core chips used in high-speed optical modules and optical interconnect products.
