Multi-FunctionalDie Bonder
DB-561P
Equipment Features
● Suitable for substrate-to-chip bonding in COB/COC processes, using either adhesive die bonding or heated eutectic bonding.
● Linear motor structure and high-precision CCD recognition and positioning system to ensure placement accuracy.
● Equipped with three independent pick-and-place heads for multi-chip die bonding.
Equipment Specifications
Customer Cases
US AOI
US AOI has introduced 10 units of our high-precision eutectic die bonders, applied in the critical chip packaging process for its 800G/1.6T high-speed optical modules.
Chengdu Guangheng Communication
Chengdu Guangheng has introduced 20 units of our high-precision eutectic die bonders, applied in the high-reliability packaging manufacturing of core optoelectronic chips for high-speed optical modules.
Wuhan Accelink Technologies
Wuhan Accelink has introduced 30 units of our high-precision eutectic die bonders, applied in the precision eutectic packaging process for core optoelectronic chips used in high-speed optical modules and advanced optical interconnect products.
