High-Precision Eutectic Die Bonder
RD-4000
Features
● Designed with a unique dual-bond-head and dual-eutectic-stage configuration, specifically engineered for COC eutectic packaging as well as small-volume adhesive bonding applications.
● Full closed-loop control of torque and position ensures micron-level placement accuracy and pressure stability.
● Automatic nozzle changing system flexibly adapts to various chip sizes and complex packaging processes.
Specifications
| System Accuracy | |
| Placement Accuracy | ±1.5μm (Reference Wafer) |
| Angular Accuracy | ±0.1° |
| Bondhead | |
| Quantity | 2 sets |
| Function | Pick & Eutectic |
| Resolution | X/Y: ±0.1 μm | Z: ±1 μm| θ: 0.01° |
| Bond Force | 10-200 g |
| Eutectic Stage | |
| Temperature Control | Heating: 100℃/s | Cooling: 30℃/s |
| Material Handling Capability | |
| Package | COC |
| Wafer Feeding | 6″ Wafers × 4 |
| Tray Feeding | 2″ Trays × 8 (Waffle-pack, Gel-pack) |
| Chip Size | 0.15 × 0.15 mm – 20 × 20 mm |
| Dimensions & Weight | |
| Dimensions | 1800 × 1320 × 1880 mm |
| Net Weight | 1800 kg |
Cases
AOI
AOI has introduced several of our high-precision eutectic die bonding machines, which are applied in the critical chip packaging processes for its 800G / 1.6T high-speed optical modules.
Chengdu Sunstar
Chengdu Guangheng has introduced several of our die bonding machines, which are used in the high-reliability packaging and manufacturing of core chips in optical modules.
Accelink
Accelink has introduced several of ourdie bonding machines, which are applied in the precision eutectic packaging processes of core chips used in high-speed optical modules and optical interconnect products.
