Multi-Functional Die Bonder
RD-3000
Features
● Suitable for various chip adhesive packaging processes with programmable placement procedures.
● The Z-axis features full closed-loop force control with a minimum of 10±1 grams.
● Supports flip-chip bonding with a visualized placement process.
Specifications
| System Accuracy | |
| Placement Accuracy | ±1.5 μm（标准片） |
| Angular Accuracy | ±0.3° |
| Bondhead | |
| Quantity | 3 sets |
| Function | 拾取和贴装 |
| Resolution | X/Y: ±0.1 μm | Z: ±0.2 μm| θ: 0.01° |
| Bond Force | 10-100 g |
| 吸嘴 | |
| 吸嘴切换 | 自动切换（12个） |
| Material Handling Capability | |
| Package | COB, COC, COS, Flip Chip, Box |
| Wafer Feeding | 12″ Wafers × 12 |
| Tray Feeding | 2″ Trays × 4 (Waffle-pack, Gel-pack) |
| Chip Size | 0.10 × 0.10 mm – 20 × 20 mm |
| Dimensions & Weight | |
| Dimensions | 1350 × 1550 × 1700 mm |
| Net Weight | 2000 kg |
Cases
AOI
AOI has introduced several of our high-precision eutectic die bonding machines, which are applied in the critical chip packaging processes for its 800G / 1.6T high-speed optical modules.
Chengdu Sunstar
Chengdu Guangheng has introduced several of our die bonding machines, which are used in the high-reliability packaging and manufacturing of core chips in optical modules.
Accelink
Accelink has introduced several of ourdie bonding machines, which are applied in the precision eutectic packaging processes of core chips used in high-speed optical modules and optical interconnect products.
