Ultrasonic TerminalWelder
UT-600
Equipment Features
● Full servo control, precisely regulating welding pressure and displacement. The welding process can be divided into multiple stages.
● Integrated automatic cleaning system with ion air purge in a sealed environment.
● Integrated multifunctionality including automatic loading and unloading, vision-guided welding positioning, and cleaning/dust removal.
Equipment Specifications
Customer Cases
US AOI
US AOI has introduced 10 units of our high-precision eutectic die bonders, applied in the critical chip packaging process for its 800G/1.6T high-speed optical modules.
Chengdu Guangheng Communication
Chengdu Guangheng has introduced 20 units of our high-precision eutectic die bonders, applied in the high-reliability packaging manufacturing of core optoelectronic chips for high-speed optical modules.
Wuhan Accelink Technologies
Wuhan Accelink has introduced 30 units of our high-precision eutectic die bonders, applied in the precision eutectic packaging process for core optoelectronic chips used in high-speed optical modules and advanced optical interconnect products.
