Multi-FunctionalDie Bonder
RD-800
Equipment Features
● Suitable for substrate-to-chip bonding in COB/COC processes, using either adhesive die bonding or heated eutectic bonding.
● Linear dual-drive gantry structure with a high-precision CCD recognition and positioning system to ensure placement accuracy.
● The bond head automatically changes nozzles or epoxy stampers to enable the placement of various types of chips.
Equipment Specifications
Customer Cases
US AOI
US AOI has introduced 10 units of our high-precision eutectic die bonders, applied in the critical chip packaging process for its 800G/1.6T high-speed optical modules.
Chengdu Guangheng Communication
Chengdu Guangheng has introduced 20 units of our high-precision eutectic die bonders, applied in the high-reliability packaging manufacturing of core optoelectronic chips for high-speed optical modules.
Wuhan Accelink Technologies
Wuhan Accelink has introduced 30 units of our high-precision eutectic die bonders, applied in the precision eutectic packaging process for core optoelectronic chips used in high-speed optical modules and advanced optical interconnect products.
