Ultrasonic Terminal Welder
UT-600
Features
● Full servo control, precisely regulating welding pressure and displacement. The welding process can be divided into multiple stages.
● Integrated automatic cleaning system with ion air purge in a sealed environment.
● Integrated multifunctionality including automatic loading and unloading, vision-guided welding positioning, and cleaning/dust removal.
Specifications
| Application | |
| Object | Pin and Holder for IGBT / SiC module and DBC |
| Material | Pure Coper, Nickel-Plated Copper, Gold-Plated Copper, Silver-Plated Copper, Aluminum |
| Material Area | 1-25 mm² |
| Material Thickness | 0.1-2.0 mm |
| Welding Performance | |
| Welding Process | Linear |
| Welding Force | 150-650 N |
| Welding Strength | >85 kgf (HPD) |
| Cycle Time | <1.2 s |
| Ultrasonic Frequency | 20 kHz |
| Welding Mode | Deformation, Time, Energy, Hybrid |
| Dimensions & Weight | |
| Dimensions | 1100 × 1720 × 1980 mm |
| Net Weight | 1800 kg |
Cases
AOI
AOI has introduced several of our high-precision eutectic die bonding machines, which are applied in the critical chip packaging processes for its 800G / 1.6T high-speed optical modules.
Chengdu Sunstar
Chengdu Guangheng has introduced several of our die bonding machines, which are used in the high-reliability packaging and manufacturing of core chips in optical modules.
Accelink
Accelink has introduced several of ourdie bonding machines, which are applied in the precision eutectic packaging processes of core chips used in high-speed optical modules and optical interconnect products.
