Multi-Functional Die Bonder
RD-800
Features
● Suitable for substrate-to-chip bonding in COB/COC processes, using either adhesive die bonding or heated eutectic bonding.
● Linear dual-drive gantry structure with a high-precision CCD recognition and positioning system to ensure placement accuracy.
● The bond head automatically changes nozzles or epoxy stampers to enable the placement of various types of chips.
Specifications
| System Accuracy | |
| Placement Accuracy | ±3 μm |
| Angular Accuracy | ±0.3° |
| Bondhead | |
| Quantity | 1套 |
| Function | 拾取和贴装 |
| Resolution | X/Y: ±0.5 μm | Z: ±0.5 μm| θ: 0.01° |
| Bond Force | 10-200 g |
| Eutectic Stage | |
| Temperature Control | Heating: 100℃/s | Cooling: 30℃/s |
| Material Handling Capability | |
| Package | COB, COC, COS, BOX |
| Wafer Feeding | 6″ Wafers × 8 |
| Tray Feeding | 2″ Trays × 6 (Waffle-pack, Gel-pack) |
| Chip Size | > 0.10 × 0.10 mm |
| Dimensions & Weight | |
| Dimensions | 1150 × 1570 × 1960 mm |
| Net Weight | 1800 kg |
Cases
AOI
AOI has introduced several of our high-precision eutectic die bonding machines, which are applied in the critical chip packaging processes for its 800G / 1.6T high-speed optical modules.
Chengdu Sunstar
Chengdu Guangheng has introduced several of our die bonding machines, which are used in the high-reliability packaging and manufacturing of core chips in optical modules.
Accelink
Accelink has introduced several of ourdie bonding machines, which are applied in the precision eutectic packaging processes of core chips used in high-speed optical modules and optical interconnect products.
