New Energy
REB SEMICONDUCTOR’s solutions focus on key steps in power module packaging. Leveraging advanced packaging technologies, we connect the power core of new energy, providing reliable manufacturing capabilities for electric vehicles, motor drives, charging piles, and automotive-grade power modules.
Related Products
Customer Cases
BYD
Chengdu BYD has introduced our ultrasonic welding machine production line, applied in the critical chip packaging process for its 800G/1.6T high-speed optical modules.
United Microelectronics Corporation (UMC)
United Microelectronics Corporation (UMC) has introduced our ultrasonic welding machines, applied in the high-reliability packaging manufacturing of core optoelectronic chips for high-speed optical modules.
StarPower Semiconductor
StarPower Semiconductor has introduced our ultrasonic welding machines, applied in the precision eutectic packaging process for core optoelectronic chips used in high-speed optical modules and advanced optical interconnect products.
