Semiconductor
REB SEMICONDUCTOR’s solutions focus on critical steps in semiconductor packaging. Leveraging advanced packaging technologies, we serve the core of semiconductor manufacturing, providing reliable manufacturing capabilities for communications, consumer electronics, industrial control, and high-performance computing.
Related Products
Customer Cases
US AOI
US AOI has introduced 10 units of our high-precision eutectic die bonders, applied in the critical chip packaging process for its 800G/1.6T high-speed optical modules.
Chengdu Guangheng Communication
Chengdu Guangheng has introduced 20 units of our high-precision eutectic die bonders, applied in the high-reliability packaging manufacturing of core optoelectronic chips for high-speed optical modules.
Wuhan Accelink Technologies
Wuhan Accelink has introduced 30 units of our high-precision eutectic die bonders, applied in the precision eutectic packaging process for core optoelectronic chips used in high-speed optical modules and advanced optical interconnect products.
