Optical Communications
REB SEMICONDUCTOR’s solutions focus on key process steps in optical communications packaging. Leveraging advanced packaging technologies, we connect the core links of optical communications, providing reliable manufacturing capabilities for data centers, AI computing, and next-generation network infrastructure.
Related Products
Customer Cases
US AOI
US AOI has introduced 10 units of our high-precision eutectic die bonders, applied in the critical chip packaging process for its 800G/1.6T high-speed optical modules.
Wuhan Linktel Technologies
Wuhan Linktel has introduced 10 units of our high-precision eutectic die bonders, applied in the high-reliability packaging manufacturing of core optoelectronic chips for high-speed optical modules.
Wuhan Accelink Technologies
Wuhan Accelink has introduced 30 units of our high-precision eutectic die bonders, applied in the precision eutectic packaging process for core optoelectronic chips used in high-speed optical modules and advanced optical interconnect products.
