Optical Communications
REB SEMICONDUCTOR’s solutions focus on key process steps in optical communications packaging. Leveraging advanced packaging technologies, we connect the core links of optical communications, providing reliable manufacturing capabilities for data centers, AI computing, and next-generation network infrastructure.
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AOI
AOI has introduced several of our high-precision eutectic die bonding machines, which are applied in the critical chip packaging processes for its 800G / 1.6T high-speed optical modules.
Wuhan Linktel Technologies
武汉联特引入我司若干高精度共晶机，应用于高速光模块中核心光电芯片的高可靠性封装制造。
Accelink
Accelink has introduced several of ourdie bonding machines, which are applied in the precision eutectic packaging processes of core chips used in high-speed optical modules and optical interconnect products.
