During the 23rd China International Optoelectronic Expo in 2021, the program team made a special visit to Shenzhen Ruibo Automation Equipment Co., Ltd., a company with outstanding technology in the field of domestic semiconductor packaging.
Shenzhen Ruibo Automation Equipment Co., Ltd., established in 2012, is a high-tech enterprise specializing in the R&D, production, sales, and service of semiconductor packaging equipment. The company is primarily dedicated to providing customers with advanced semiconductor packaging solutions.
Since its establishment, the company has consistently upheld the corporate spirit of “determined to forge ahead and strive for excellence.” It has assembled a highly experienced technical R&D team and is equipped with a CNC precision machining workshop, a standardized assembly workshop, and a precision equipment calibration workshop. Additionally, it is fully outfitted with coordinate measuring machines (CMM), high-precision image measurement instruments, and micron-level laser interferometers, ensuring that products are delivered on time and meet quality standards. Currently, the company’s product portfolio covers semiconductor packaging processes including dispensing, die bonding, wire bonding, and automated integration, with dozens of patents secured. The company’s products are widely used in the semiconductor and optical communications industries.
Huo Cunkui, Sales Manager of Shenzhen Ruibo Automation Equipment Co., Ltd., stated: “We have independently developed software image processing and high-precision motion control technologies, which are applied in our series of fully automated packaging equipment. Our flagship products include the 25G TO packaging equipment, COC packaging equipment, TO56 eutectic equipment, and COB packaging equipment. Among these, the 25G TO packaging equipment is designed for the eutectic assembly of large heat sinks and holders in 25G TO56 and TO60 applications, offering a certain level of industry leadership. The TO eutectic machine is compatible with 1.25G, 2.5G, 10G, and 25G LD eutectic processes. The COC eutectic packaging equipment enables LD eutectic bonding onto substrates and features a pulsed heating temperature control system, making it suitable for fully automated packaging in COC processes. Our automatic adhesive die bonder is designed for high-precision planar and deep-cavity adhesive die bonding applications, such as TO56, TO46, and COB.”
In the future, facing the dual demands of significantly improved manufacturing precision and efficiency, the Ruibo team will continue to forge ahead and innovate in the field of semiconductor packaging, developing more intelligent automation equipment to provide high-quality and efficient services to industry partners.
This program aired on September 27 on Shenzhen Finance and Economy Channel.
